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SSD form factor | 2.5" |
---|---|
Memory type | 3D TLC NAND |
SSD capacity | 960 GB |
Component for | Server/Workstation |
Manufacturer | Lenovo |
Availability | In Stock |
Hard drive | |
---|---|
SSD capacity | 960 GB |
Memory type | 3D TLC NAND |
Data transmission | |
Random write (4KB) | 33000 IOPS |
Random read (4KB) | 95000 IOPS |
Write latency | 80 µs |
Read latency | 170 µs |
Endurance | |
Mean time between failures (MTBF) | 3000000 h |
Certificates | |
Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
Performance | |
Interface | Serial ATA III |
Component for | Server/workstation |
Hot-swap | Yes |
SSD capacity | 960 GB |
S.M.A.R.T. support | Yes |
Memory type | 3D TLC NAND |
Random write (4KB) | 33000 IOPS |
Random read (4KB) | 95000 IOPS |
Mean time between failures (MTBF) | 3000000 h |
Write latency | 80 µs |
Read latency | 170 µs |
Compatible products | ThinkSystem |
Design | |
---|---|
Component for | Server/workstation |
Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
SSD form factor | 2.5" |
Features | |
Interface | Serial ATA III |
Component for | Server/workstation |
Hot-swap | Yes |
SSD capacity | 960 GB |
S.M.A.R.T. support | Yes |
Memory type | 3D TLC NAND |
Random write (4KB) | 33000 IOPS |
Random read (4KB) | 95000 IOPS |
Mean time between failures (MTBF) | 3000000 h |
Write latency | 80 µs |
Read latency | 170 µs |
Certification | Micron Green Standard Built with sulfur resistant resistors CE (Europe): EN 55032 Class B, RoHS UKCA (UK): SI 2016/1091 Class B and SI 2012/3032 RoHS FCC: CFR Title 47, Part 15 Class B UL/cUL: approval to UL-60950-1, 2nd Edition, IEC 60950-1:2005 (2nd Edition); EN 60950-1 (2006) + A11:2009+ A1:2010 + A12:2011 + A2:2013 BSMI (Taiwan): approval to CNS 13438 Class B and CNS 15663 RCM (Australia, New Zealand): AS/NZS CISPR32 Class B KC RRA (Korea): approval to KN32 Class B, KN 35 Class B W.E.E.E.: compliance with EU WEEE directive 2012/19/EC TUV (Germany): approval to IEC60950/EN60950 VCCI (Japan): 2015-04 Class B IC (Canada): ICES-003 Class B Morocco: approval to EN55032/EN55024 Class B UkrSEPRO (Ukraine): EN55032 Class B, IEC60950/EN60950, RoHS (Resolution 2017 No. 139) |
SSD form factor | 2.5" |
Compatible products | ThinkSystem |
Power | |
Power consumption (write) | 3.1 W |
Power consumption (read) | 2.8 W |
Operational conditions | |
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Operating relative humidity (H-H) | 5 - 95% |
Non-operating shock | 1500 G |
Technical details | |
Interface | Serial ATA III |
Hot-swap | Yes |
S.M.A.R.T. support | Yes |
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Operating relative humidity (H-H) | 5 - 95% |
Non-operating shock | 1500 G |
SSD form factor | 2.5" |
Weight & dimensions | |
Width | 70 mm |
Weight | 70 g |
Height | 7 mm |
Depth | 100 mm |
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---|---|---|---|---|---|---|
SKU |
4XB7A82260
|
MZILS3T8HCJM-00003
|
MZQLB7T6HMLA-00007
|
MZWLJ3T8HBLS-00007
|
MZ7LM3T8HCJM-00003
|
MZQL27T6HBLA-00A07
|
Manufacturer |
Lenovo
|
Samsung
|
Samsung
|
Samsung
|
Samsung
|
Samsung
|
Component for |
Server/workstation
|
Server/workstation
|
Server/workstation
|
Server/workstation
|
N/A
|
Server/workstation
|
SSD capacity |
800GB to 1000GB
|
N/A
|
N/A
|
N/A
|
N/A
|
N/A
|
SSD form factor |
2.5"
|
2.5"
|
2.5"
|
2.5"
|
2.5"
|
U.2
|
Interface |
Serial ATA III
|
N/A
|
PCI Express 3.0
|
PCI Express 4.0
|
Serial ATA III
|
PCI Express 4.0
|
Memory type |
3D TLC NAND
|
TLC
|
V-NAND MLC
|
N/A
|
N/A
|
MLC
|
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